Monday, 05 January 2009

Product Analysis:

Here's a closer look at the PC3200XL modules from Corsair. You will notice that Corsair has done nothing special to the physical looks in order to make this product stand out. This means that there is no physical difference between the PC3200LL Pro/Non-Pro and PC3200XL Pro/non-Pro modules. In order to support the low latency modules from Samsung, you must provide 2.75v to the memory. This is a little high considering how Corsair's first-generation of PC3200LL modules were rated at similar latencies (2-2-2-6) and operated at much lower vDIMMs. This, obviously, is a difference between Samsung and Winbond ICs as they are both operated to run at different voltages.

After we removed the heatspreaders from the memory, we were confronted by Samsung's K4H560838F-TCCD chips. Below shown are specifications and features of these chips.

Specifications

Features

K4

Samsung

H

DDR SDRAM

56

256M 8K Refresh

08

Organization = 8

3

4 Banks

8

Interface = SSTL_2 2.5V

F

Generation 7th

T

TSOP Package

C

Normal Temperature Range

 



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